Solder ball
For particles in solder paste, see Solder paste § Classification.
In integrated circuit packaging, a solder ball, also a solder bump (ofter referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules.[1] The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux.[2]
A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability.[3]
Usage in flip chip method
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Pads
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Balls
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Alignment
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Contact
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Solder reflow
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Adhesive underfill
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Final result
See also
- "Head in pillow", a solder ball failure
References
- ↑ Definition of: solder ball, PC Magazine glossary
- ↑ Soldering 101 - A Basic Overview
- ↑ Patent US 7622325 B2, prior art description
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